Thermal Properties of Materials

Thermal Conductivity, W/cm-K

• Metals
  • Aluminum 2.165
  • Beryllium 1.772
  • Beryllium-copper 1.063
  • Brass 70% copper, 30% zinc 1.220
  • Copper 3.937
  • Gold 2.913
  • Iron .669
  • Lead .343
  • Magnesium 1.575
  • Molybdenum 1.299
  • Monel .197
  • Nickel .906
  • Platinum .734
  • Silver 4.173
  • Stainless Steel-321 .146
  • Stainless Steel-410 .240
  • Steel, low carbon .669
  • Tin .630
  • Titanium .157
  • Tungsten 1.969
  • Zinc 1.024
• Semiconductors
  • GaAs .591
  • Silicon (pure) 1.457
  • Silicon (.0025 ohm-cm) .984
  • Silicon Dioxide (amorphous) .014
  • Silicon Dioxide (quartz) c-axis .11
  • Silicon Dioxide (quartz) a-axis .059
  • Silicon Nitride .16 - .33
  • Silicon Carbide .90
• Insulators
  • Air (still) .0003
  • Sapphire c-axis .35
  • Sapphire a-axis .32
  • Alumina .276
  • Alumina 85% .118
  • Beryllia 99.5% 1.969
  • Beryllia 97% 1.575
  • Beryllia 95% 1.161
  • Boron Nitride (hot pressed) .394
  • Diamond (room temperature) 6.299
  • Diamond (77 K) 24.
  • Diamond (room temperature, isotopically pure) 50.
  • Epoxy .002
  • Thermally conductive epoxy .008
  • Glass .008
  • Heat sink compound (metal oxide loaded grease) .004
  • Mica .007
  • Mylar .002
  • Phenolic .002
  • Silicone Grease .002
  • Silicone Rubber .002
  • Teflon .002
  • FR-4 or G-10 PC board material .003
  • water .0055
  • Liquid Helium (4.2K) .000307
  • Liquid Nitrogen (77K) .001411
  • Liquid Argon (85K) .001258
• Thermally Conductive Elastomers
  • Bergquist Sil-pads .009
  • Tecknit Consil-C 871 .023
  • Tecknit Consil-R 350 .00433 to .00732
  • Saracon 2.9e-3 cal/cm-sec-K
  • Chomerics XTS-274 alumina filled elastomer .002 cal/sec cm K
  • Cho-seal 1224 .038
  • Cho-therm .0433
  • Cho-therm 1678 .018
  • Cho-therm 1671 .027